https://doi.org/10.1140/epjb/s10051-025-01101-2
Regular Article - Solid State and Materials
Simulation and optimization of the drawing process for Bi-based rectangular high-temperature superconducting wires
1
School of Material Science and Engineering, Northwestern Polytechnical University, 710072, Xi’an, China
2
Superconducting Materials Research Center, Northwest Institute for Nonferrous Metal Research, 710016, Xi’an, China
Received:
18
February
2025
Accepted:
20
November
2025
Published online:
28
November
2025
Bi2Sr2CaCu2O8+δ (Bi-2212) rectangular wires exhibit many advantages in the fabrication of low-porosity coils and the welding of mechanical reinforcement. However, Ag between filaments is prone to breakage, which severely deteriorates wire mechanical and current-carrying properties. To elucidate the effects of die structure and processing parameters on rectangular deformation behavior and performance optimization of wires, in this paper, two special die structures were designed for forming the Bi-2212 rectangular wires. The effects of die structure, processing rate, and filament number, as well as annealing process, on the mechanical properties and supercurrent carrying capacity of Bi-2212 rectangular wires were systematically studied. The correlation between processing parameters and the Ag fracture between filaments was qualitatively analyzed, the mechanism of reducing tensile stress via die wall support during drawing process was revealed, and the structure of the die used for forming rectangular wire was optimized to solve the problem of Ag fracture between filaments. The results indicated that, as the wires with 666-filament via annealing treatment were subjected to forming using biaxial deformation die, the better rectangular wires with nearly fracture-free interfaces can be obtained, and the sintered Bi-2212 rectangular wires achieved a yield strength of 100 MPa as well as a critical current density of 80,000 A mm−2 at 4.2 K by magnetization measurement.
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© The Author(s), under exclusive licence to EDP Sciences, SIF and Springer-Verlag GmbH Germany, part of Springer Nature 2025
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

