https://doi.org/10.1140/epjb/s10051-023-00619-7
Regular Article - Solid State and Materials
The effect of thermal stress on crack-inclusion problem in inhomogeneous superconducting cylinder
School of Science, Lanzhou University of Technology, 730050, Lanzhou, China
Received:
16
September
2023
Accepted:
5
November
2023
Published online:
14
November
2023
In this paper, the effect of thermal stress on crack-inclusion problem in inhomogeneous superconducting cylinder in the cooling process is investigated. By using the gradient finite element method, the thermodynamic coupling equation is solved numerically and the thermal stress is obtained during the drop from room temperature to operating temperature. Then the stress intensity factors for the cooling process are solved. The effects of thermal stress on crack growth are discussed, and the effects of the inclusion on crack growth under thermal stress are analyzed. According to the results, the crack length increases to promote the crack growth, then the effect of thermal stress on the crack growth increases as the crack length increases. In addition, the size and type of the inclusion, as well as the distance of the inclusion from the crack tip, can also affect the crack extension.
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© The Author(s), under exclusive licence to EDP Sciences, SIF and Springer-Verlag GmbH Germany, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
