https://doi.org/10.1140/epjb/s10051-024-00680-w
Regular Article - Solid State and Materials
Role of humidity and surface roughness on direct wafer bonding
1
Peter Grünberg Institute (PGI-1), Forschungszentrum Jülich, 52425, Jülich, Germany
2
MultiscaleConsulting, Wolfshovener Str. 2, 52428, Jülich, Germany
3
SLAC National Accelerator Laboratory, 94025, Menlo Park, CA, USA
Received:
23
December
2023
Accepted:
20
March
2024
Published online:
17
April
2024
Bodies made from elastically stiff material usually bind very weakly unless the surfaces are flat and extremely smooth. In direct wafer bonding flat surfaces bind by capillary bridges and by the van der Waals interaction, which act between all solid objects. Here we study the dependency of the work of adhesion on the humidity and surface roughness in hydrophilic direct wafer bonding. We show that the long-wavelength roughness (usually denoted waviness) has a negligible influence on the strength of wafer bonding (the work of adhesion) from the menisci that form from capillary condensation of water vapor.
© The Author(s) 2024
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